FORMATION OF CROSS-CUTTING STRUCTURES WITH DIFFERENT POROSITY ON THICK SILICON WAFERS

Abstract

Through three−layered structure has been formed on silicon wafers 500 microns thick by electrochemical etching in a solution of hydrofluoric acid without using additional deletions monocrystalline layers. The resulting structures are divided into two types. The first type pass−through structure comprises two outermost macroporous silicon layers 220—247,5 microns thick with a pore diameter 7—10 microns and an average mesoporous silica layer 5—60 microns thick with a pore diameter of 100—150 nm. The second type pass−through structure includes macroporous silicon layer 250 microns in thickness, interlocking in the depth of the silicon wafer to form a cavity the size of 4—8 microns. The developed technology will allow forming monolithic structures of membrane−electrode assembly microfuel elements in an easier and more reliable manner.