Abstract

In this paper we demonstrate a technological route for the formation of an array of memristor structures using a self-assembly matrix of porous anodic aluminum oxide. We propose using a porous alumina matrix as a solid mask to develop pores in the dense silicon oxide layer below the mask, in which a material characterized by the possibility of resistive switching is formed. The merit of this mask should include reproducibility and the high-precision control of geometric parameters of the pores. The current-voltage characteristics of a memristor structure based on solid electrolyte Cu2S are determined.

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