Abstract
A silicidation process was suggested by investigating the solid-state reaction of the and Ni(Pt,Ti)/oxide/Si systems. The Ni ternary alloy was found to be able to both greatly push upward the nucleation temperature of high-resistivity phase, making use of the stabilizing effect of Pt, and tremendously alleviate the oxide sensitivity concerns during NiSi phase formation, utilizing the ability of Ti to react with oxide, possibly coupled with the catalytic effect of Pt, while not seriously impairing the silicidation process. Further, the phase-formation sequence during alloy silicidation and the variation of the film-layer structures and elemental diffusion with annealing temperatures were closely examined in order to reveal the possible physical and chemical mechanisms of both systems. Finally, the technological significance of this silicidation process was pointed out.
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