Abstract
The external morphology of free surfaces of Cu/Sn thin films was studied using scanning electron microscopy, electron microprobe analysis and X-ray diffraction. It was shown that the aging of samples of type A (films deposited at room temperature) and type B (copper underlayer deposited at 623 K) at room temperature leads to the formation of hillocks and whiskers; however, the annealing of as-prepared samples at temperatures in the range 363–483 K leads to hillock formation only. The density of hillocks and whiskers in type A samples is two times higher than that in type B samples. The length of the whiskers in type A films (about 4 × 10 -6 m) is one order of magnitude lower than that of the whiskers in type B samples (about 3 × 10 -5 m). This large difference is due to the texture {200} of tin films in type B samples. In type C samples, after aging at room temperature, we observed only hillocks whose diameter could reach 10 × 10 -6 m. Whiskers and hillocks are composed essentially of tin, and the matrix is composed of the Cu 6Sn 5 phase.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
