Abstract
A film of 1-octadecyl-1H-imidazole (OI) has been formed on copper surface by the self-assembly technique. The optimum concentration of OI and immersion period for the formation of protective OI film have been established using electrochemical impedance spectroscopy (EIS). X-ray photoelectron spectroscopy (XPS), reflection absorption FTIR spectroscopy, atomic force microscopy (AFM), and contact angle measurements have been used to characterize the OI film on copper surface. The efficiency of OI film to protect copper from corrosion in aqueous NaCl environment has been investigated using EIS, potentiodynamic polarization studies, cyclic voltammetry, scanning electron microscopy (SEM) and weight-loss studies. All these studies showed that the OI film offers excellent protection against corrosion of copper. The mechanism of corrosion protection of copper by the OI film is discussed.
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