Abstract
The morphology and growth of interfacial intermetallic compound (IMC) between Sn-3.0Ag-0.5Cu solder alloy and Cu substrate metal of solder joint is reported. The IMC morphology and IMC thickness layer were observed at three different porosities of porous Cu interlayer. The results revealed that during soldering process, Cu6Sn5 compound with scallop like morphology was formed at the interface of both the solder alloy and Cu substrate and at solder alloy and porous Cu interlayer. By adding porous Cu interlayer at the solder joint, the IMC thickness increased with increasing soldering temperature and the number of pores in porous Cu interlayer. The effect of porosity on increasing the IMC layer was also due to the slower cooling rate during solidification of molten solder.
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