Abstract
The effects of excimer light irradiation on polysilazane coatings formed on PET films with vacuum-evaporated SiO2 coatings and the effects of these coatings on gas barrier characteristics have been investigated. The temperature during light irradiation has a large effect on the coating’s molecular structure and gas barrier characteristics. When irradiation was performed at 100℃, the polysilazane coating transformed into a silica coating, and a compact silica coating at a much lower temperature than with heat treatment alone was produced. Surface irregularities in the vapor-deposited silica coating were smoothed out by the formation of a polysilazane coating, which was transformed into a compact silica coating when irradiated with light, resulting in a significant improvement in the gas barrier characteristics. The water vapor permeability of the thin coating irradiated with excimer light at 100℃ showed only 0.04 g/m2•day (40℃, 90% RH). According to the results of investigation of temperature variation of water-vapor permeability, it is inferred that the developed film has an excellent gas barrier value, namely, 4.90 × 10–4 g/m2•day at 25℃. This gas barrier coated PET film is transparent and flexible, and can be used in the fabrication of flexible electronics. Also, the proposed fabrication method effectively provides a simple low-cost and low-temperature fabrication technique without the need for high vacuum facility.
Highlights
For the generation of electronic products, attention has recently turned to products with flexible properties such as wearable devices, flexible batteries, electronic paper and flexible display devices that are thin, light and flexible [1]-[6]
The effects of excimer light irradiation on polysilazane coatings formed on polyethylene terephthalate (PET) films with vacuum-evaporated SiO2 coatings and the effects of these coatings on gas barrier characteristics have been investigated
When irradiation was performed at 100 ̊C, the polysilazane coating transformed into a silica coating, and a compact silica coating at a much lower temperature than with heat treatment alone was produced
Summary
For the generation of electronic products, attention has recently turned to products with flexible properties such as wearable devices, flexible batteries, electronic paper and flexible display devices that are thin, light and flexible [1]-[6]. There are strong expectations of developments in flexible electronic devices that are needed to make these products. An essential component of flexible electronics is a flexible substrate on which various devices can be formed. Flexible substrates are generally made using flexible organic resin films. Ordinary organic films have poor gas barrier characteristics against oxygen, water vapor and the like. This can result in problems such as oxidation of various devices formed on these films, leading to serious performance degradation issues. There is a strong demand for the development of flexible substrates that have good gas barrier characteristics. What is needed is a simple method for the formation of dense inorganic coatings on organic films with low heat tolerance
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