Abstract
Formation of dendritic interfacial electrodes (DIEs) between metal/polymer interfaces has high demands in a variety of areas. By combining impregnation electroplating (IEP) step with impregnation-reduction (IR) step under straightforward conditions, we report a novel method of preparation of dendritic interfacial metal electrodes of palladium, platinum, silver and copper inside an ionomer for ionic polymer-metal composites (IPMC) application. The depth of palladium DIEs can be controlled by adjusting the reaction time, and the maximum depth can almost reach up to contact from the both sides of ionomer with a total thickness of 200 μm. The capacitance and actuation performance of IPMC was dramatically enhanced because of the presence of DIEs.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
