Abstract

We propose a novel Forked-Contact, Dynamically-Doped Multigate transistor as ultimate scaling booster for both Si and 2D materials in aggressively-scaled nanosheet devices. Using accurate dissipative DFT-NEGF atomistic-simulation fundamentals and cell layout extrinsics, we demonstrate superior and optimal device characteristics and invertor energy – delays down to sub-30-nm pitches, i.e., a 10 nm scaling boost compared to the nanosheet MOSFET references, regardless of the material system used. This gain is linked to a more compact architecture but does not change the material-specific fundamental gate-length limit that we also assess here. By switching from Si to 2D materials, however, an additional 5 nm reduction in gate length scaling could be enabled.

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