Foreword Special Section on “Advances in Electrical Modeling and Validation of Electronic Packaging and Systems”

Abstract

In a time where the demands for electronic systems and components are rising in an unprecedented fashion, the complexity for designing these components and systems is increasing at a similar pace. From wearable and handheld devices to autonomous vehicles to data centers and supercomputers, the growing amount of integration and the demand for more efficient access to ever-increasing data are pushing the state-of-art design methods to their limits. In this environment, innovative research is necessary to push the capability of electrical modeling and validation methods in order to equip the electronic design community with the most adequate tools to tackle the emerging challenges.