Abstract
Grinding is a microscopic chipping process for removing material from metal or other hard surfaces. This is commonly accomplished by a rotating wheel consisting of abrasive grains bonded into place with a resin or ceramic material. Aluminum oxide and silicon carbide are the usual abrasives. The most frequently used bond is a vitrified composition of feldspars and clays fired in a ceramic process along with a desired mixture of abrasives. This type of wheel is very hard and easily subject to damage and is normally used in a stationary grinding position. For portable hand-held grinding a resin bonded wheel is used. Resinoid wheels have a more porous structure than vitreous wheels and can be used at high speeds for cool cutting. Frequently fabric reinforcement is used within the structure of the wheel, and it may be operated at higher RPM than other types of wheels.
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Schedule a callMore From: Proceedings, annual meeting, Electron Microscopy Society of America
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