Abstract
This paper proposes an effective method to determine the optimal parameters settings of reflow soldering profile and helps reduce the try-and-error time in practical application. Due to the complex nonlinear relationship between reflow thermal profile and process parameters in this problem, BPNN is adopted to establish the model for description of this intricate relationship between inputs and outputs. According to the requirements of the reflow soldering profile, GA is used to calculate the best input parameters with its strong global research ability. Thus, a combined model with BPNN and GA is proposed for parameters optimization and contributes to reduction of decision time of input parameter for reflow soldering profile. In addition, a case study is given to prove the accuracy of the proposed method.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
