Abstract
A heat sink device is used with specific power input at 100V and 20W by the heater attached at the base plate of copper and then obtaining the average temperature of Heat sink by the help of 10 thermocouples .Two specimens of heat sinks were designed and were tested for mass flow rate and heat transfer coefficient. With base of 1.5mm&2.5mmtip thickness and another specimen with dimensions as tip0.5mm and1.00mmbase thickness are used By experimenting and CFD simulations, optimization of heat sink design was done.Then correlation and Validation foe both the specimen was done and were found satisfactory results
Highlights
In modern and recent advances in the science & technology, especially in the electronics and computer application area a lot of advancements has taken place in Electronic cooling in CPU
Wirtz et al (1994) [1]experimentally studied the effect of flow bypass on longitudinal fin heat sinks. They evaluated inter-fin velocity from measured values of fin heat transfer coefficients and used these results to derive a correlation for inter-fin velocity in terms of Reynolds number as a function of the free stream Reynolds number and fin density
The temperatures are measured on heat sink by ten(10) J type of thermocouples
Summary
In modern and recent advances in the science & technology, especially in the electronics and computer application area a lot of advancements has taken place in Electronic cooling in CPU. Software simulations correlation was done for better design and performance of the heat sinks. Wirtz et al (1994) [1]experimentally studied the effect of flow bypass on longitudinal fin heat sinks. They evaluated inter-fin velocity from measured values of fin heat transfer coefficients and used these results to derive a correlation for inter-fin velocity in terms of Reynolds number as a function of the free stream Reynolds number and fin density. Yuan et al (1996)[2] studied flow bypass effects on straight fin heat sinks in a rectangular duct by computational fluid dynamics modelling. Sultan, [4]; R Mohan and P Govindarajan,[6],springer,journal of mechanical science and technology,&KSME
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