Force Measurement with Piezo Electric Sensors in Advanced Packaging

Abstract

AI, 5G, IoT, ADAS, AR/VR and other new applications is giving the semiconductor industry plenty of growth opportunities. With the adoption of these technologies the pressure is on, to increase performance. The industry is using the power advantages of lower technology nodes and Advanced Packaging to put increased functionality on a single small form-factor which makes production processes even more challenging. This advancements in semiconductor technology and added device complexity put additional pressure on monitoring and controlling Semiconductor packaging processes. The optimization of processes is a precondition for high reliability which is achieved by selecting appropriate materials and controlling critical process parameters. Currently Chip test, monitoring and control of packaging processes is widely done via optical-, displacement Sensors and Electrical Testing. Improved methods for process monitoring and failure identification are needed to maintain or improve the quality and yield of a packaging process. The physical force quantity causing a device failure may not be accessible to conventional measuring methods but is equally important to control and monitor production processes such as bonding, pick and place and encapsulation. Piezo dynamic force measurement technology allows force to be monitored and controlled with high resolution even at low forces. As a result, deviations can be detected early, errors avoided, and Semiconductor Advanced Packaging Equipment builders can achieve higher and more accurate machine performance. Semiconductor Manufacturing-Packing companies in the semiconductor industry benefit from higher process visibility, performance, lower quality cost and traceability of process data.