Abstract
Ultrasound has broad range of applications from underwater examination, nondestructive testing of materials and medical diagnosis and treatment. The ultrasonic transducer plays an vital role in determining the resolution, sensitivity, as well as other diagnostic capabilities of an ultrasonic imaging system. Current piezoelectric transducer which dominates the medical field has limited applications compared to the capacitive ultrasonic transducer. The capacitive transducer is easy to fabricate compared to the piezoelectric transducer. In this work, the fabrication of a foldable substrate for a capacitive ultrasonic transducer has been discussed. The foldable substrate was fabricated using an ultrathin silicon wafer which is 50 µm thick by using the principle of polymer shrinkage. It is believed that the foldable substrate can be used in intravascular ultrasound (IVUS) and endoscopic ultrasound (EUS) applications for next generation biomedical imaging.
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