Abstract
The dimensions of discrete passives, passive integrated components (arrays, networks) and embedded integral ones should be significantly reduced in the nearest future. For example, passive components with 01005 package size will be commercially available in 2010. This means that the effective length of resistor in/on such package should be approximately two times smaller than the package length. This paper presents fabrication and preliminary electrical characterisation of Fodel microresistors fabricated from EP E-93350-153 (1 kΩ/□) photopatternable resistor ink and Ag-based DP 6453 Fodel conductors. Two versions of microresistors––screen-printed and made in full Fodel process––were made and compared. The effective resistor dimensions varied from 50×50 to 800×200 μm 2. The processing achievements and problems are presented and discussed. The relation between designed and fabricated patterns is compared for both technological versions. The sheet resistance, hot temperature coefficient of resistance and long-term stability at elevated temperature are characterised as a function of resistor geometry and related to length and width of microresistors. Also normalised temperature dependencies of resistance in a wide temperature range (between −170 and 130 °C) are presented and analysed.
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