Abstract
The fluxless soldering using a YAG laser for tape carrier package (TCP) has been investigated. We developed the fluxless soldering using the sputtering effect of laser irradiation with high power density (31 W, ϕ150 μm) and the reduction of hydrogen gas (5 vol%) for the removal of oxide film. The removal of the oxide film on the solder surface by the laser sputtering was investigated by Auger electron spectroscopy (AES). The laser irradiation time without the heat damage to PCB was optimized using the general finite elements analysis program, ANSYS. The results of the fluxless soldering were comparable with that in air using rosin mildly activated (RMA) flux.The fluxless soldering using a YAG laser for tape carrier package (TCP) has been investigated. We developed the fluxless soldering using the sputtering effect of laser irradiation with high power density (31 W, ϕ150 μm) and the reduction of hydrogen gas (5 vol%) for the removal of oxide film. The removal of the oxide film on the solder surface by the laser sputtering was investigated by Auger electron spectroscopy (AES). The laser irradiation time without the heat damage to PCB was optimized using the general finite elements analysis program, ANSYS. The results of the fluxless soldering were comparable with that in air using rosin mildly activated (RMA) flux.
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