Abstract
Nowadays, dielectric materials with excellent mechanical and hydrophobic properties are desired for use in the integrated circuits (ICs). For this reason, low dielectric constant fluorographene/polyimide (FG/PI) composite films were prepared by a facile solution blending method, suggesting that the mechanical, electrical, hydrophobic and thermal properties were significantly enhanced in the presence of FG. With addition of 1wt% FG, the tensile strength, Young’s modulus and elongation at break were dramatically increased by 139%, 33% and 18% respectively when compared with pure PI film. Furthermore, composite films exhibit superior hydrophobic and thermal stability performance. Especially, the FG/PI film with 0.5wt% of FG possessing a low dielectric constant of 2.48 and a good electrical insulativity that is lower than 10−14Sm−1. Therefore, by their excellent performance, FG/PI hybrid films represent suitable candidate solutions with applications in the microelectronics and aerospace industries.
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