Abstract

In this letter, we are demonstrating that the fluidic assisted heterogeneous integration is an efficient integration method of various photonic devices with standard silicon electronic devices to realize advanced photonic integrated systems. By using a thin-film device format, which is optimized in its host substrate, its integration on silicon substrate does not interfere with a post layer-by-layer process and provides the best performance of both thin-film devices and silicon-based electronics. A combination of self-assembly and thin-film device technology will lead the way for wafer-scale heterogeneous thin-film integration. The results showed that an array of thin-film devices can be efficiently self-aligned and integrated onto assigned integration. This is also a promising integration method for integrated photonic systems, which combines various photonic devices with silicon-based electronic devices.

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