Abstract

Computational fluid dynamics (CFD) software has been extensively employed in the design of thermal management systems for electronics. There continues to be a need for experimental evaluation of thermal management systems in order to validate the results of the CFD simulations. This primarily experimental research explores several heat transfer enhancing inserts for a liquid cooled base plate channel design applied to an array of generic power amplifier units. Several different channel insert configurations (both geometric and material type) are investigated as mini-heat exchangers using both copper fins and graphite foam. Experimental data were recorded measuring the chip temperatures as a function of volume flow rate. CFD simulations were also conducted to guide the experimental program. Effective convective heat transfer coefficients were likewise reverse-engineered using CFD software and the experimental measurements. This work has a focus on the cooling liquid volume flow rate impact on the thermal management of a high packing density array of power amplifiers using liquid cooling .

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