Flow boiling in microchannels enhanced by parallel microgrooves fabricated on the bottom surfaces

Abstract

Flow boiling in microchannels is one of the most desirable cooling solutions for high power electronics. However, it is challenging to promote the flow boiling performance, particularly critical heat flux (CHF), due to their unfavorable liquid rewetting. Inlet restrictors (IRs) have been successfully used to manage two-phase instabilities in flow boiling in microchannels. However, IRs would result in extremely high pressure drop. In this study, without using IRs, parallel microgrooves (W=50 µm, H=250 µm, L=10 mm) are fabricated on the bottom surface of five parallel microchannels (W=200 µm, H=250 µm, L=10 mm) to effectively manage two-phase flow instabilities without sacrificing pressure drop. Our visualization study shows that these microgrooves can enable rewetting at highhigh frequencies up to 151 Hz and enhance thin film evaporation with the highest thin film ratio of 0.65. A highly desirable periodic rewetting mechanism can substantially delay CHF conditions and enhance heat transfer rates. Flow boiling in the present microchannel configuration has been systematically characterized with mass flux ranging from 100 kg/m2s to 600 kg/m2s. Compared to plain-wall microchannels, flow boiling heat transfer coefficient (HTC) is enhanced up to ~72% at a mass flux of 210 kg/m2s due to the sustainable thin film evaporation. Moreover, CHF is substantially enhanced by ~155% at a mass flux of 389 kg/m2s due to the rapid and periodic rewetting enabled by these decorated microgrooves. We also observed that the enhancement of HTC fades when mass flux exceeds 346 kg/m2s due to flooding.