Abstract
We developed a new float polishing technique for use as a non-contact polishing tool utilizing a magnetic compound fluid (MCF). MCF has been developed by one of the present authors for the purpose of magnetically and hydrodynamically improving intelligent or smart fluid. The float polishing succeeded experimentally during wide clearance range between the polishing tool and the polished material surface of 0.1–0.3 mm. The polishing effect changes according to the magnetic field strength. The cause is due to the possibility of polishing a material using magnetic clusters involved in MCF as a polishing tool. It is also useful to substitute the buffer material for the polishing pad in the case of MCF float polishing.
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