Abstract
In this study, flip chip on board evaluations were carried out using Taguchi design of experiments. Simple but high yield procedures for rework of flip chip on board using anisotropic conductive adhesives and anisotropic conductive films were developed. Underfill and encapsulation processes for flip chip on board using eutectic solder bumps were also evaluated. The flip chips were assembled on test vehicles for temperature cycling and high temperature/high humidity tests. The reliability performance of the three processes-gold bumps with anisotropic conductive film, anisotropic conductive adhesive, and eutectic solder with underfill-is also discussed in this paper.
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