Abstract
MEMS microphones must be further miniaturized for use in mobile devices. So we developed packaging technologies for MEMS microphones using flip chip technology instead of wire bonding. The first two generations have the sound hole in a ceramic interposer at the bottom side of the package. Now a new flip chip microphone package with the sound hole on the top side has been developed. The new package technology combines a large acoustic reference volume for good signal to noise ratio with small size. Compared to other microphone packages the sensitivity is improved by 3 dB. The front volume is small to avoid resonances in the acoustic frequency range.
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