Flip‐chip Bonding on Green Tape Ceramic Substrates

Abstract

Due to increasing density and high demands on electrical and thermal performance, modern packages require alternative chip interconnection and substrate technologies. Flip‐chip (FC) bonding is a suitable method for high interconnection densities. Compared with wire bonding and TAB, FC provides the highest contact density. This is due to the possibility of using the whole chip surface for bondpads (area bumps). In this paper, an adapted FC technology on green tape ceramic substrates was investigated. In order to reduce the substrate costs, FC bonding was performed directly on the thick film metallisation without the application of thin film technology for the upper substrate layers. Two solder bump metallurgies: PbSn95/5 and Au/Sn solder bumps were applied for fluxless FC bonding on adapted substrate metallisations. Fluxless soldering is performed by single chip bonding and requires substrates with narrow planarity tolerances. An alternative method using a wet eutectic Au/Sn solder paste on the substrate and Au bumps permits the application of substrates with standard planarity tolerances used in thick film applications. A common reflow of all chips of a multichip module is possible. First reliability results of metallurgical analysis and of the mechanical and electrical behaviour of the FC contacts after thermal cycling are presented.