Abstract
Nickel-chromium films have been deposited with good reproducibility and reasonable uniformity of sheet resistance using a rudimentary evaporation technique. A standardized process flow has resulted in circuit yields of approx. 99 per cent for design values of sheet resistance up to 200 Ω/sq. and yields of 89 and 79 per cent for 260 and 325 Ω/sq., respectively. Circuits stabilized with (a minimum of) 2 hr air bake at 320°C have shown excellent resistor stability and reliability through packaging and environmental testing for design values up to 420 Ω/sq.
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