Abstract
The originality of this work is to print with flexography process conductive silver lines suitable for Low Temperature Co-fired Ceramics (LTCC) multilayer systems. Screen printing conductive paste with 65% silver flake particles was optimised for flexography process. Patterns with different line widths – from 100 to 600 μm – were printed in two directions, parallel and perpendicular to printing orientation. Printed lines withstood temperature as high as 875°C for one hour, relative to conventional sintering profile of LTCC multilayer systems. Line width, thickness and roughness decreased after sintering. A minimum line width of 153 μm was measured on sintered lines. Line thickness varied from 1.8 to 3.8 μm and line roughness from 0.7 to 0.9 μm after sintering. Conductive silver lines along 34 cm length were accomplished after sintering. Very low values of electrical resistivity were measured on the sintered lines. This study demonstrates the huge potential of flexography printing for LTCC multilayer systems.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
