Abstract
Thermal management is the most critical technology challenge for modern electronics. Recent key materials innovation focuses on developing advanced thermal interface of electronic packaging for achieving efficient heat dissipation. Here, for the first time we report a record-high performance thermal interface beyond the current state of the art, based on self-assembled manufacturing of cubic boron arsenide (s-BAs). The s-BAs exhibits highly desirable characteristics of high thermal conductivity up to 21 W/m·K and excellent elastic compliance similar to that of soft biological tissues down to 100 kPa through the rational design of BAs microcrystals in polymer composite. In addition, the s-BAs demonstrates high flexibility and preserves the high conductivity over at least 500 bending cycles, opening up new application opportunities for flexible thermal cooling. Moreover, we demonstrated device integration with power LEDs and measured a superior cooling performance of s-BAs beyond the current state of the art, by up to 45 °C reduction in the hot spot temperature. Together, this study demonstrates scalable manufacturing of a new generation of energy-efficient and flexible thermal interface that holds great promise for advanced thermal management of future integrated circuits and emerging applications such as wearable electronics and soft robotics.
Highlights
Thermal management is the most critical technology challenge for modern electronics
Thermal management has been calling on the development of new materials with ultrahigh thermal conductivity[27]
As demonstrated through thermal and mechanical characterizations, the boron arsenide (BAs) thermal interface exhibits record-high performance with an unprecedented combination of high thermal conductivity (κ ~ 21 W/m ∙ K), excellent elastic compliance similar to that of soft biological tissues (E ~ 100 kPa), and high flexibility that are beyond the current state-of-the-art and could lead to advanced thermal management of solid-state and flexible electronics
Summary
Thermal management is the most critical technology challenge for modern electronics. Recent key materials innovation focuses on developing advanced thermal interface of electronic packaging for achieving efficient heat dissipation. As demonstrated through thermal and mechanical characterizations, the BAs thermal interface exhibits record-high performance with an unprecedented combination of high thermal conductivity (κ ~ 21 W/m ∙ K), excellent elastic compliance similar to that of soft biological tissues (E ~ 100 kPa), and high flexibility that are beyond the current state-of-the-art and could lead to advanced thermal management of solid-state and flexible electronics.
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