Abstract
Flexible clay polymer nanocomposite films with heat durability and high moisture-barrier property were prepared by using Li+-exchanged bentonite and polyethyleneglycol-modified lignin. Analyses revealed that the films comprised of laminated clay mineral layers and the lignin intercalated between the layers. The films retained their heat durability up to 350°C, and their moisture vapor transmission rate (MVTR) at 40°C a relative humidity (RH) of 90% was 1.64gm−2day−1, which is lower than that of plastic films. The low MVTR originated from not only the water-resistant bentonite, owing to the migration of interlayer Li+ ions into the octahedral sheets after annealing, but also the modified lignin. Consequently, the films have potential as a flexible substrate for electronic devices.
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