Abstract
Achieving both efficient thermal management and electromagnetic interference (EMI) shielding for intelligent electronic devices is one of the major challenges currently faced by materials engineers. Most reported material innovations focus only on single purpose projects, and issues including complex preparation methods, poor mechanical strength, and low economic benefit are common. In this study, the shape-stable phase change composites (SSPCCs) of polypropylene/carbon nanotubes/ferroferric oxide/paraffin wax (PP/CNTs/Fe3O4/PW) were fabricated using a facile process with excellent thermal management performance, EMI shielding effectiveness (EMI SE), and appropriate flexibility. This advantageous manufacturing technology enables CNTs to form effective thermal and electrical pathways in the matrix. With the synergistic effect of CNTs and Fe3O4, the resulting SSPCC displays high volume conductivity (31.0 S/m), suitable thermal conductivity (0.59 W/mK), and excellent EMI SE (41.2 dB). Additionally, SSPCC retains effective thermal stability and durability, and excellent temperature-control property. The convenient manufacturing method has tremendous application prospects for advanced thermal management and EMI shielding of future integrated circuits, as well as excellent overall performance.
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