Abstract

An innovative segment of the semiconductor and electronics industry in the last years is driven by new sensors embedded in smart devices and systems with thin form factor, connected to existing infrastructures via standard communication interfaces. The increased maturity of industrial sensor technologies and associated readout electronics enabled new products penetrating multiple market sectors. Among the different classes of smart sensing systems that can be realized with thin and truly flexible form factor, thin film strain gauges are ideally suited for the implementation of pressure sensing membranes. In this work we will focus on the development of static and dynamic testing methods of a strain gauge module whose applications are intended as a flexible and conformable strain/pressure sensor, adaptable for wireless communications.

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