Flexible 3D deep microstructures of silica glass by laser-induced backside wet etching

Abstract

The well-controlled fabrication of microtrenches including inclined features using normal incidence with gradual shifting of the irradiated area was demonstrated. Based on the variation of trench width depending on the laser fluence, the existence of gaps between the edge of the irradiated area and sidewall of the trench was shown. Because of these gaps, the shifted laser pulse can stay at the bottom of the trenches in the fabrication of the inclined features. In laser-induced backside wet etching (LIBWE), the photo-activated region generated within organic solution would act on the glass surface and results in etching. It was indicated that the photo-activated region generated at the bottom of the trenches acted not only on the bottom of the trench but also on the sidewalls. Based on such etching of the sidewall, fabrication of inclined features becomes possible. In this method, the tilting angle can be changed within one deep trench. Flexible structure formation deep inside the silica glass can be achieved.