Abstract
Driven by the demand for more versatile personal electronic devices such as cellular phones and handheld computers, flash memory has advanced rapidly to higher volume density and performance levels. Today, semiconductor manufacturers find a growing opportunity for more advanced flash memories delivered either as standalone flash devices; embedded as cores with logic in single-chip devices; or packaged as stacked dice with microcontrollers, logic, or static RAM. For flash manufacturers, however, success in these highly competitive markets requires tight control over the cost of test, despite rising device complexity. As flash memory grows in size, speed, and complexity, manufacturers are seeking more cost-effective, single-insertion test solutions capable of addressing resulting test challenges. With the development of new test architectures, manufacturers can more efficiently address emerging flash complexity using cost-effective, next-generation test platforms.
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