Abstract
With the development of multifunction and miniaturization in modern electronics, polymeric films with strong mechanical performance and high thermal conductivity are urgently needed. Two-dimensional transition metal carbides and nitrides (MXenes) have attracted extensive attention due to their tunable surface chemistry, layered structure and charming properties. However, there are few studies on using MXenes as fillers to enhance polymer properties. In this paper, we fabricate a three-dimensional foam by the freeze-drying method to enhance the interfacial interaction between adjacent MXene sheets and polyimide (PI) macromolecules, and then a composite film with a dense and well-ordered layer-by-layer structure is produced by the hot-pressing process. Based on the secondary orientation strategy, the resultant MXene/PI film exhibits an enhanced thermal conductivity of 5.12 ± 0.37 W m−1 K−1 and tensile strength of 102 ± 3 MPa. Moreover, the composite film has good flexibility and flame retardancy owing to the synergistic effect of MXene sheets and PI chains. Hence, the MXene/PI composite film with the properties of flexibility, flame-retardancy, high mechanical strength and efficient heat transmission is expected to be used as the next thermal management material in a variety of applications.
Highlights
With the advent of the 5G era, modern electronics are developing rapidly toward the multifunction and miniaturization direction.[1,2,3] The technical integration of high-power chips, wireless charging, bluetooth and multi-angle folding has caused a severe challenge to the heat dissipation and strength of electronic devices.[4,5] to effectively dissipate heat in time and transform the brittleness of materials, composites synchronously with excellent thermal and mechanical properties are urgently needed
We fabricate a three-dimensional foam by the freeze-drying method to enhance the interfacial interaction between adjacent MXene sheets and polyimide (PI) macromolecules, and a composite film with a dense and well-ordered layer-by-layer structure is produced by the hot-pressing process
The poly(amic acid) (PAA) solution is mixed with the MXene (Ti3C2Tx) suspension to enhance the interfaces between MXene sheets
Summary
With the advent of the 5G era, modern electronics are developing rapidly toward the multifunction and miniaturization direction.[1,2,3] The technical integration of high-power chips, wireless charging, bluetooth and multi-angle folding has caused a severe challenge to the heat dissipation and strength of electronic devices.[4,5] to effectively dissipate heat in time and transform the brittleness of materials, composites synchronously with excellent thermal and mechanical properties are urgently needed. Compared with the other three material systems of wood, metal and silicate, polymeric materials are attracting more and more attention due to their light weight, exibility, easy processing and excellent corrosion resistance.[6] most polymers are inherently poor conductors of heat and electrons, which limits their applications in electronic devices greatly. These electronic devices face serious re hazards caused by accidental electrical leakage or aging generally.[7,8] it is difficult to restrain the re spread in most polymeric materials once it occurs. Research and preparation of multifunctional materials with high strength, good thermal conductivity and ame retardancy at the same time have far-reaching academic signi cance and wide practical value
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