Flame retardancy and dielectric properties of dicyclopentadiene‐based benzoxazine cured with a phosphorus‐containing phenolic resin

Abstract

AbstractA dicyclopentadiene‐based benzoxazine (DCPDBZ) was prepared and separately copolymerized with melamine–phenol formaldehyde novolac or phosphorus‐containing phenolic resin (phosphorus‐containing diphenol) at various molar ratios. Their curing behaviors were characterized by differential scanning calorimetry. The electrical properties of the cured resins were studied with a dielectric analyzer. The glass‐transition temperatures were measured by dynamic mechanical analysis. The thermal stability and flame retardancy were determined by thermogravimetric analysis and a UL‐94 vertical test. These data were compared with those of bisphenol A benzoxazine and 4,4′‐biphenol benzoxazine systems. The effects of the diphenol structure and cured composition on the dielectric properties, moisture resistance, glass‐transition temperature, thermal stability, and flame retardancy are discussed. The DCPDBZ copolymerized with phosphorus‐containing novolac exhibited better dielectric properties, moisture resistance, and flame retardancy than those of the melamine‐modified system. The flame retardancy of the cured benzoxazine/phosphorus‐containing phenolic resins increased with increasing phosphorus content. The results indicate that the bisphenol A and 4,4′‐biphenol systems with a phosphorus content of about 0.6% and the dicyclopentadiene system with a phosphorus content of about 0.8% could achieve a flame‐retardancy rating of UL‐94 V‐0. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008