Abstract
Fivefold annealing twin has been observed in nanocrystalline Cu at zero external stress. The microstructure of the multifold twins at various annealing temperatures has been examined by transmission electron microscopic in detail. Contrary to the well known sequential twinning mechanism, coherent twin boundaries formed via migration of grain boundary segment were proposed to be the dominant mechanism of fivefold annealing twin, which associated with grain growth during annealing. Moreover, the possibilities of the proposed mechanism may operate in forming fivefold deformation twin were discussed.
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