Abstract

Formulas for the driving force of electromigration have been presented using concepts of the tension density, the external force density, and the effective charge tensor density. The ``dynamic'' wind charge tensor density $Z{\ensuremath{\downdownarrows}}_{a\mathrm{dynamic}\mathrm{}\mathrm{wind}}(\mathbf{r})$ has been revealed over and above the conventional ``static'' wind charge tensor density $Z{\ensuremath{\downdownarrows}}_{a\mathrm{static}\mathrm{}\mathrm{wind}}(\mathbf{r}).$ We have demonstrated the application of the concepts to electromigration reliability problems of ultralarge-scale integration devices where extremely high current densities should be maintained through ultrathin film interconnects. Quantum mechanical wave-packet propagation of an Al atom has been examined in some models of thin Al lines which contain atomic defects, using the first-principle electronic structure calculations under the periodic boundary condition. The dynamical electronic properties by our simulation have demonstrated the characteristic features of the $Z{\ensuremath{\downdownarrows}}_{a\mathrm{dynamic}\mathrm{}\mathrm{wind}}(\mathbf{r})$ in the course of the Al electromigration in the bulk, surface, and grain boundary.

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