Abstract
A finite-element method is formulated to simulate the diffusive growth of thegrain boundary voids. Two rate processes, grain boundary diffusion and surfacediffusion, are concomitant. In the finite-element method, the surfacediffusion and the grain boundary diffusion are coupled by boundary conditionsat the triple point of the void surface and the grain boundary. Finite-elementsimulations show that the void growth is controlled by the relative magnitudeof the grain boundary and surface diffusion coefficients, the applied tensilestresses and the void spacing. When the surface diffusion process is theslower process, as occurring in the case of highly applied tensile stress andsmall void space, the voids grow in a crack-like manner. Otherwise, the voidsremain rounded during growth.
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