Abstract
The effect of PbSn solder joint strength on temperature tests in laser diode packaging has been studied experimentally and numerically. It was found that the solder joint strength increased as temperature cycle number increased. A finite-element method (FEM) analysis is performed on the calculation of joint strength of PbSn solder in temperature cycling tests for laser diode packaging. Numerical calculations were in good agreement with the experimental measurements that the solder joint strength increased as the temperature cycle increased. This is may be due to the redistribution of the residual stresses within the solder during the temperature cycling tests, and hence reducing the residual stresses and increasing the solder joint strength as the temperature cycle number increased. The result suggests that the FEM is an effective method for predicting the solder joint strength in laser diode packages.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
