Abstract

Bent micro-tubes have been frequently applied in electronics, medical devices and aerospace for heat transfer due to the increasing heat flux in high-density electric packages. Rotary-draw bending (RDB) is a commonly used process in forming tubes due to its versatility. However, the control of forming defects is the key problem in micro-tube bending in terms of wall thinning, cross-sectional deformation and wrinkling. In this paper, a three-dimensional (3D) finite-elements (FE) modeling of electrically-assisted (EA) RDB of 6063 aluminum alloy micro-tubes is developed with the implicit method in ABAQUS. The multi-field coupled behavior was simulated and analyzed during the EA RDB of micro-tubes. Several process parameters such as micro-tube diameter, bending radius, current density and electrical load path were selected to study their effects on the bending defects of the Al6063 micro-tubes. The simulated results showed that the cross-sectional distortion could be improved when electrical current mainly pass through the vicinity of the tangent point in the micro-tube RDB, and the cross-sectional distortion tended to decrease with the increases of current density and tube diameter, and the decreases of bending speed and radius. A trade-off should be made between the benefit and side effect due to electrical current since the risk of wall thinning and wrinkling may increase.

Highlights

  • With the miniaturization of electronics, medical devices and micro-satellites, more and more high-performance electronical systems such as high-resolution CCD have been integrated into increasingly small spaces [1,2]

  • We first analyze the distribution and evolution behavior of electrical, thermal and stress-strain fields during EA Rotary-draw bending (RDB) of micro-tubes based on the simulation results under die-to-die configuration

  • Considering the beneficial effects caused by the so-called electroplasticity [18], it is rational to believe that the EA RDB has the advantages

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Summary

Introduction

With the miniaturization of electronics, medical devices and micro-satellites, more and more high-performance electronical systems such as high-resolution CCD have been integrated into increasingly small spaces [1,2]. The heat flux density soars and the non-uniform temperature distribution in the devices is enhanced, causing the premature failure of the electronical systems [3]. This extreme thermal condition cannot be addressed by solely traditional thermal management technique. Similar to traditional tube bending, micro-tube bending is a typical nonlinear process affected by various parameters and the so-called size effects, exhibiting multiple defects such as wrinkling, overthinning, cross-section distortion and springback [7] These forming defects undoubtedly weaken the thermal exchanging ability of the heat pipe or even make it disappear

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