Abstract
In this paper, ANSYS, a finite element analysis software is used to simulate the change of temperature field in micro-hole processing with millisecond laser, which determines the diameter and depth of the hole drilled. The relationship between processing parameters and the hole size is plotted, so as to achieve size control of a micro-hole processing. Compared with experimental results, simulation is effective for laser processing of micro-hole and can be referenced to choose the best processing parameters.
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