Abstract
A total of two computational procedures have been developed in the commercial finite element software codes Sysweld and ABAQUS to analyse and predict the residual stress state after the repair of small weld defects in thin structural components. The numerical models allow the effects of the repair to be studied when a pre-existing residual stress field is present in the fabricated part and cannot be relieved by a thermal treatment. In this work, the modelling strategies are presented and tested by simulating a repair of longitudinal welds in thin sheets of Inconel 718. Although the numerical strategies in the two codes are intrinsically different, the results show a significant agreement, predicting a notable effect imposed by the initial residual stress.
Highlights
Optical couplers are used extensively for telecommunication applications as a component to couple light into photonic integrated circuits (PICs)
This work reports on the design of a hybrid plasmonic‐photonic vertical coupler (HVC) with an ultra‐compact footprint and one‐step dielectric waveguide coupling
This paper presents a new class of HVC, that is, 2P‐numerical aperture (NA) HVC, comprised of a 2P‐NA coupled directly to a SOI waveguide
Summary
Optical couplers are used extensively for telecommunication applications as a component to couple light into photonic integrated circuits (PICs). This work reports on the design of a hybrid plasmonic‐photonic vertical coupler (HVC) with an ultra‐compact footprint and one‐step dielectric waveguide coupling This VC is based on a unique two‐plane plasmonic nanoantenna (PNA) array (2P‐NA) with a wavelength‐scale footprint. The key innovations of our device compared to conventional Yagi‐Uda antennas [5,6,7,8,9,10,11] are the use of dual‐feed elements and in‐ and out‐of‐plane constructive interference of the electric dipole, electric quadrupole, and magnetic dipole moments of the 2P‐NAs elements These innovations provide strong CE, high directivity (D), large polarisation extinction ratio (PER) and ultra‐broadband operation—making our device attractive for both telecommunications and other integrated ultra‐broadband applications (e.g. Raman spectroscopy)
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