Finite element modelling and damage quantification of chip seals

Abstract

Finite element modelling of complex structures such as chip seals has become a viable practice to obtain an insight into the structure's response behaviour. These responses are difficult, if not impossible to measure in the field and are used to explain seal failure mechanisms. The three major failure mechanisms include: surface aggregate loss, surface cracking and surface texture loss. 2D Finite element chip seal models of single and double seals were developed and analysed for each failure mechanism and a variety of chip seal design variables. The chip seal model response results were quantified in terms of equivalent load application to failure by means of laboratory-developed transfer functions. The results indicated that design assumptions such as the 40:1 light vehicle to heavy vehicle equivalent damage factor should be addressed and thus demonstrated that finite element modelling of chip seals is a powerful alternative in determining surface deterioration.