Abstract
As a result of the ban of lead from solder joints, many lead-free solder joints were developed. Most of the electronic equipment is subjected to random vibration. This study develops an analysis methodology based on finite element analysis and vibration tests to predict the failure and fatigue life of the electronic package soldered using Sn-1Cu-1Ni-1Ag under random vibration. A specially designed printed circuit board having ball grid array packages soldered is used in the study. Finite element model is developed in ANSYS and modal analysis was done. The finite element results were validated with experiments (impact test). Random vibration analysis was also done. These results were validated with random vibration experiments. Using the finite element results, it was predicted that the corner solder joints will fail first. It was observed in the random vibration experiment that corner solder joint failed first and the maximum stress generated was 12.8 MPa. Thus, Sn-1Cu-1Ni-1Ag is a promising lead-free solder joint alloy under random vibration combining with its mechanical properties.
Highlights
Soldering is a very old metallurgical joining method in which two or more metals are joined without melting the parent metals, but by melting and flowing a filler metal into the joint, the melting temperature will be less than 315 °C [1,2]
This paper investigated the effect of random vibration in electronic package soldered using lead-free solder alloy Sn-1Cu-1Ni-1Ag
Random vibration tests were conducted with white noise Power Spectral Density (PSD) acceleration amplitude as the input
Summary
Soldering is a very old metallurgical joining method in which two or more metals are joined without melting the parent metals, but by melting and flowing a filler metal (solder) into the joint, the melting temperature will be less than 315 °C [1,2]. As a result Pb cannot be a component in the solder alloy. The researchers around the globe started research for making new lead-free solder alloys which can be used in place of SnPb solder alloy. Most of the research has focused on the failure mechanism and fatigue life prediction under thermal loads. When compared to thermal fatigue studies, less number of studies were conducted in the area of electronic packages. Most electronic components and electronic packages are exposed to random vibration
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