FINITE ELEMENT ANALYSIS OF TIME-DEPENDENT BUCKLING OF POLYSILICON MICRO BEAMS WITH TEMPERATURE-DEPENDENT PROPERTIES

Abstract

International Journal of Computational Engineering ScienceVol. 04, No. 02, pp. 393-396 (2003) Design, Modelling and SimulationNo AccessFINITE ELEMENT ANALYSIS OF TIME-DEPENDENT BUCKLING OF POLYSILICON MICRO BEAMS WITH TEMPERATURE-DEPENDENT PROPERTIESM. SHAMSHIRSAZ, M. BAHRAMI and M. TAYEFEHM. SHAMSHIRSAZNew Technologies Research Center, Amirkabir University of Technology (Tehran Polytechnic), Iran Search for more papers by this author , M. BAHRAMIDepartment of Mechanical Engineering, Amirkabir University of Technology (Tehran Polytechnic), IranAerospace Research Institute, Iran Search for more papers by this author and M. TAYEFEHDepartment of Mechanical Engineering, Amirkabir University of Technology (Tehran Polytechnic), Iran Search for more papers by this author https://doi.org/10.1142/S1465876303001356Cited by:3 PreviousNext AboutSectionsPDF/EPUB ToolsAdd to favoritesDownload CitationsTrack CitationsRecommend to Library ShareShare onFacebookTwitterLinked InRedditEmail AbstractIt is important to investigate the time-dependent deformation of MEMS devices such as thermally driven micro beams because it affect theirs reliability. In this paper, time-dependent buckling of clamped-clamped polysilicon micro beams under high stress and temperature has been modeled by Finite Element Analysis (FEA). A thermo-mechanical, non-linear model has been developed in this analysis. The temperature dependency of polysilicon properties have also been formulated and modeled in this analysis. Depending on input current, two different polysilicon mechanical behaviors, pure elastic buckling and elasto-plastic deformation have been studied. The goal is to consider the changes of elasto-plastic behavior and thermal properties of polysilicon with temperature in this model. The clamped-clamped micro beam of 2μm wide, 2μm thick and 100μ m long is modeled. For buckling phenomenon to occur, this clamped-clamped beam is self-heated by an electrical current input. These micro beams are made of heavily doped polysilicon and are fabricated by surface micro machining technology. The simulation results show the importance of temperature-dependent properties of polysilicon on deflections of micro beams under compressive stress. A comparison is made between the time dependant results obtained from FEA and the experimental results in the literature.Keywords:Post-bucklingTemperature-dependentTime-dependentMicro beampolysilicon References K. S. Teh and L. Lin, Microelectronics Journal 30, 1169 (1999). Crossref, Google ScholarL. Lin and M. Chiao, Sensors and Actuators A55, 35 (1996). Google ScholarM. Chiao and L. Lin, Journal of Microelectromechanical systems 9(1), 146 (2000). Crossref, Google ScholarC. D. Lottet al., Sensors and Actuators A101, 239 (2002). Google ScholarR. S. Chen, C. Kung and G. B. Lee, Journal of Micromechanics and Microengineering 12, 291 (2002). Crossref, Google ScholarN. D. Mankame and G. K. Ananthasuresh, Journal of Micromechanics and Microengineering 11, 452 (2001). Crossref, Google Scholar W. N. Sharpe, M. A. Eby and G. Coles, Effect of Temperature on Mechanical Properties of Polysilicon, Transducer 2001, Munich, 1366-1369 . Google Scholar FiguresReferencesRelatedDetailsCited By 3Polysilicon micro beams buckling with temperature-dependent propertiesM. Shamshirsaz and M. B. Asgari23 February 2008 | Microsystem Technologies, Vol. 14, No. 7Postbuckling analysis of a thermally driven microbeam under realistic conditionsMohsen Tayefeh and Mohsen Bahrami25 April 2006 | Journal of Physics: Conference Series, Vol. 34Stochastic estimation of microactuator bucklingMohsen Bahrami and Mohsen Tayefeh25 April 2006 | Journal of Physics: Conference Series, Vol. 34 Recommended Vol. 04, No. 02 Metrics Downloaded 5 times History KeywordsPost-bucklingTemperature-dependentTime-dependentMicro beampolysiliconPDF download