Finite element analysis of thermal shock tests of RF connectors

Abstract

Digital or virtual testing of prototypes is frequently carried out in product design and testing for reducing the time as well as the cost of product development. An example on the thermal shock test of a radio frequency (RF) connector is presented. The thermal shock test of the RF connector is analyzed using the finite element method. The initial temperature condition of terminal and pin is assumed to be the room temperature (25 °C), and a cyclic temperature variation from −65 to 165 °C with a frequency of four cycles per hour is applied on the outer surfaces, similar to the thermal shock test under standard MIL-STD-883 test condition. The RF connector is found to work properly under these thermal shock loadings.