Finite element analysis of the thermal characteristics of MEMS switches

Abstract

Electrostatically actuated microswitches and relays have been developed at Northeastern University and Analog Devices, Inc. Here, we report a steady-state thermal-electrical finite element model of microswitches with gold-gold contacts. The modeling results show that in a microswitch with a typical geometry, the thermal constriction occurs in the thin film trace leading up to the contact, and not at the contact interface. The model correctly predicts the switch voltage at which the drain trace melts, but underestimates the switch resistance, and therefore overestimates the failure current. SEM images indicate that the contact area increases significantly with current.