Finite Element Analysis of Sn-58Bi Shear Test

Abstract

Finite element analysis (FEA) of quasi-static single lap shear test was conducted to study the mechanical properties of Sn-58Bi in terms of deformation, strain, stress, yield strength and ultimate strength. The study generated results of simulated behaviour of low temperature Sn-Bi solder alloy to address the demand of low temperature solder alloys in the electronic industry. The geometry was constructed in SolidWorks based on ASTM D1002 standard before being imported to ANSYS. The simulation was conducted at shear velocity of 0.1, 0.5, 1 and 1.27 mm/min and temperature of 138, 178, 208 and 238 °C using ANSYS. The simulation results were compared with the corresponding experimental results. Simulation results showed that an increase in shear velocity caused a decrease in ultimate strength and an increase in ductility of Sn-58Bi. As the velocity increased from 0.5 to 1.27 mm/min, the ultimate strength decreased from 339.87 to 291.24 MPa. This is predicted due to the Bi-rich layer within the lamellar structure of Sn-Bi alloy. An increase in temperature caused an increase in ultimate strength and brittleness in Sn-58Bi due to the trans-granular propagation of brittle failures along the weak Bi-abundant phase. As the temperature increased from 138 to 238°C, ultimate strength increased from 290.46 to 298.93 MPa.