Abstract
Abstract With the gradual development of integrated circuits to thin, high-performance and versatile of electronic products is becoming more and more powerful, and its integration and assembly density continue to improve, which will lead to the increase of its working power consumption and heat. If not timely treatment of heat dissipation problems, which will lead to heat concentration in the diode PN junction, it will reduce the service life of LED lights, and in severe cases, it will even burn the LED device. Therefore, it is crucial to improve heat dissipation efficiency of LED and reduce the junction temperature of chip. An LED structure with aluminum material and an LED structure with graphene material are analyzed by finite element method to study the heat dissipation efficiency of the graphene material. The results reveal that the heat dissipation effect of high conductivity graphene composites provides a convenient evaluation method for the subsequent use of the new materials. The research in this paper shows that the software simulation method can effectively analyze the thermal conductivity of practical engineering applications.
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