Abstract
A novel method of bonding surface mount components to screen-printed fabric circuits is proposed. The method is achieved by applying the same technique of screen-printing conductive ink patterns of fabric circuit for printing a layer of low-temperature solder paste onto uncured conductive ink pads, and placing the circuit with mounted components inside an oven for a one-step curing process. A screen-printing frame with 42 μm mesh opening is used for both conductive ink and solder paste layers. Thus, a 0.2 mm resolution for printed traces and spaces is achieved, which meets the demanding geometrical requirements of most integrated circuit chips with fine-pitch and tiny footprints. Measurement results show the printed tracks after curing exhibit excellent conductivity while retaining good flexibility. Examination under the microscope shows the components are well-bonded to their on-fabric pads. The proposed method for surface component mounting and one-step curing process for screen-printed fabric circuits can potentially streamline and expedite the twin process of circuit fabrication and component mounting for future smart textile applications.
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